TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY

Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy

The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. T...

Effect of the Bi content on the mechanical properties of a Sn-Zn-Al-Bi solder alloy

Because of environmental and health concerns, some alternative solder alloys, named lead-free ones, are being developed. Among them, the Sn-Zn-Al system has been studied and reveals promising properties. Selection of the solder alloys, for the electronic industry applications, is conditioned by their mechanical properties due to the stress produced in service. The studied alloys were produced b...

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

In this study, an addition of Ag micro-particles (8–10 lm) with a content in the range between 0 and 1.5 wt.% to Sn–9Zn eutectic solder, were examined in order to understand the effect of Ag additions as the particulate reinforcement on the microstructural and mechanical properties as well as the thermal behavior of the newly developed composite solders. Here, an approach to prepare a micro-com...

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy